Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging

Advancements in production techniques PCB manufacturing industries are still required as compared to silicon-ICs fabrications. One of the concerned areas PCBs fabrication is use conventional methodologies for metallization. Most manufacturers using traditional Copper (Cu) laminates on base substrate and patterning structures lithography processes. As a result, significant amounts metallic parts etched away during any mass process, causing unnecessary disposables leading pollution. In this work, new approach Cu metallization demonstrated with considerable step-reducing pattern-transfer mechanism. steps, seed layer covalent bonded (CBM) chemistry top dielectric epoxy resin polymerized actinic radiation intensity 375 nm UV laser source. The proposed method capable desirable geometries above-mentioned surface modification followed by To metallize patterns, proprietary electroless bath has been used. grows only selective polymer-activated locations thus called highlight technique its occurrence at low temperature (20–45 °C). paper, FR-4 polyurethane (PU) were used achieve various geometries, useful electronics packaging. addition, analysis process parameters some challenges witnessed development also outlined. case, planar inductor fabricated demonstrate application technique.